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ACS711
Hall Effect Linear Current Sensor with Overcurrent
Fault Output for < 100 V Isolation Applications
Package EX, 12-Contact QFN
With Fused Sensed Current Loop
1
A
3.00 BSC
12
1
0.85
1.27
MIN
12
0.30
2
3.00 BSC
1.00
2.90
0.80
MIN
Branded Face
0.50
9X
D
0.08 C
SEATING
PLANE
C
2.05 REF
0.70
0.50 BSC
0.75 ±0.05
C
2.70
PCB Layout Reference View
0.25 –0.07
+0.05
1
NNNN
1.79
0.20
2
B
0.40±0.10
YYWW
LLLL
1
12
E
Standard Branding Reference View
N = Device part number
Y = Last two digits of year of manufacture
W = Week of manufacture
L = Lot number
For reference only, not for tooling use (reference JEDEC MO-220WEED
except for fused current path)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Fused sensed current path
C Reference land pattern layout (reference IPC7351
QFN50P300X300X80-17W4M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
D Coplanarity includes exposed current path and terminals
E
Branding scale and appearance at supplier discretion
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
15
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